The components of the Dual lenses and Stereo speakers for iPhone 7 start Produced

GadgetXp.com - Chip and component supplier for Apple, including Cirrus Logic and Analog Devices (ADI), is rumored to have started working on the orders of some components for the iPhone. Apple iPhone production estimates that 7 will increase in the second and third quarters, ahead of its launch in September 2016.

Cirrus Logic is one of the important supplier in the chain of production of the iPhone.Because according to the opinion of the analyst Barclays, iPhone 7 will feature dual speakers, the components will be supplied by the Austin-based company.

In a research note to investors, Barclays said that the dual speakers are likely to take over the space of a 3.5 mm headphone jack. Some of the sources of any note had been predicting that Apple will remove the 3.5 mm headphone jack on the iPhone and Apple will further support the use of connectors Lightning for everything from audio output functions, charging, and to connect it with other devices. It also supports Bluetooth headphones and adapter, digital-to-analog, which could allow the use of headphones is non-Lighting.

iPhone 7


Meanwhile, the iPhone or the iPhone 7 7 Plus will have a dual-lens camera systems,with components of the drivers provided by ADI. Hardware dual-lens it is based on the technology Linx, which will produce a photo on your iPhone and iPhone 7 Plus with this level of quality is brighter and more details such as the results of a photo on a DSLR camera. Quantity multi-camera lens aperture Linx features an impressivepicture quality in a smaller size than single-camera aperture. Well, this means iPhone 7Plus can also minimize the size dimensions of the camera lens.

The report also strengthened the rumors that claim Apple will choose suppliers other than chips from Samsung to iPhone, namely to suppliers of original Taiwan chip,TSMC. TSMC reported party has been aggressively expanding its chip production capacity 16nm FinFET and will start the production of the volume of chips based onthe technology of fan-out integrated (INFO) in the second quarter of 2016.

At the end of September 2015, the hardware of the iPhone 
6s and the iPhone Plus 6s use various sizes of chip A9 from Samsung and TSMC. Samsung produces 14-nanometer chip number 96 millimeters square, while TSMC manufactures chips 16-nanometers and has a size of square millimeter 104.5. There is a difference between the size of the chip artificial TSMC and Samsung, which is sharpened by the presence of an initial benchmark difference found in artificial TSMC A9 Chip. A9 chip artificial TSMC to surpass Samsung battery endurance in the sector up to 22%.

Other rumors claim that the iPhone will most likely have 7 design waterproof, does not have a rear antenna, Wireless charging and supported.

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